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TEL: +886-2-8226-7786


Intel® Elkhart Lake Atom® x6000 Processor

Main Features
  • Intel® Atom® x6000 processor
  • 1 x SO-DIMM DDR4 with non-ECC SO-DIMM 3200 MHZ up to 32GB
  • Support triple display VGA, HDMI, LVDS
  • 2 x Intel® GbE LAN, 2 x USB 3.2 (Gen1), 3 x USB 2.0, 3 x RS232
  • 1 x RS232/485/422, 1 x SATA3.0 , 8-bit GPIO, HD Audio
  • 1 x M.2 Key B
  • TPM 2.0
  • 12V or 24 V auto detect


The EBC 358X is an 3.5” SBC. It is equipped with Intel Atom® x6000 processor. It comes with four DDR4 SO-DIMM sockets up to 32GB DDR4 3200MHz with non-ECC support and integrated UHD graphic controller.

EBC 358X operates at a temperature range from -40°C to 80°C, this design is ideal for embedded applications that run in outdoor or semi-outdoor environments, such as outdoor systems installed in harsh environments, home automation, and thin clients.

3.5” SBC Target Market:
Energy and environment/traffic signal control and monitoring/speed cameras/railway gates/MRT-TVM/charging stations


CPU Support

  • Intel Atom® x6000 series processors, BGA 1493
    - Intel® Atom® x6425E processor, Quad Core, 1.5M Cache, 2.0GHz (3.0GHz), 12W.
    - Intel® Atom® x6413E processor, Quad Core, 1.5M Cache, 1.5GHz (3.0GHz), 9W.
    - Intel® Atom® x6211E processor, Dual Core, 1.5M Cache, 1.3GHz (3.0GHz), 6W.

Main Memory

  • DDR4-3200 SO-DIMM sockets supported

  • AMI (UEFI)

  • 1 x VGA (resolution up to 1920 x 1080@60Hz)
  • 1 x HDMI 1.4b (resolution up to 3840 x 2160@30Hz)
  • 1 x Dual channel 18/24-bit LVDS (resolution up to 1920 x 1080@60Hz)

  • 1 x SATA 3.0/1 x SATA power connector x 1(+5V)

Expansion Slot  
  • 1 x Full size mPCIe with Nano-SIM (support PCIe/USB 2.0 Interface)
  • 1 x M.2 3042 Key B (support SATA/PCIe/USB 3.2 Gen1) with nano-SIM

Rear I/O  
  • 2 x USB 3.2 Gen 1
  • 2 x GbE LAN (Intel i210-IT)
  • 2 x USB 2.0
  • 1 x VGA, 1 x HDMI connector

Internal I/O
  • 2 x USB 2.0 (pin header)
  • 4 x Serial ports:
  • 1 x RS232, 2 x RS232/485/422
  • 1 x Front panel header, 8-bit digital I/O(4-In/4-Out)
  • WDT, supports onboard TPM 2.0
  • HD Audio (Line-Out, SPK-Out, Mic-In)
  • 1 x Fan connector
  • 1 x 4-pin (2 x 2) ATX power connector

Power Requirements  
  • 1 x 4-pin (2 x 2) ATX power connector
    - Input power DC 12V or 24V only
  • Support both AT and ATX power supply mode

  • 3.5” SBC form factor, (146mm x 105mm)

  • Board level operation temperature: -40°C to 80°C. (base on the cooler kit)
  • Storage temperature: -40˚C to 85˚C
  • Relative humidity:
    - 10% to 95% (operating, non-condensing)
    - 5% to 95% (non-operating, non-condensing)

  • Meet CE /FCC Class A

Ordering Information


EBC 358X (P/N: 10E00035803X0)
3.5” SBC, Intel® Atom® x6425E Processors , temperature: -40°C to 80°C

EBC 358X-6413E (P/N: 10E00035805X0)
3.5” SBC, Intel® Atom® x6413E Processors, operation temperature: -40°C to 80°C

EBC 358X-6211E (P/N: 10E00035806X0)
3.5” SBC, Intel® Atom® x6211E Processors, temperature: -40°C to 80°C

Optional Accessories

EBC 358X cool kit (P/N:10E00035808X0 )

EBC 358 heat spreader kit (P/N:10E00035804X0)

* Heat Spreader: Please note that the heat spreader is a thermal coupling device that comes in contact with the CPU through thermal gap fillers. It is designed to transfer the heat away from the CPU and is different to a heatsink in terms of cooling properties. Please do not consider it as a heatsink. Additional thermal gap fillers can be used on other components on the module to allow them to come in contact with the heat spreader for heat dissipation.


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